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Proceedings Paper

Spectroscopic multilayer film thickness measurement system
Author(s): Masahiro Horie; Nariaki Fujiwara; Masahiko Kokubo; Hiroshi Kakiuchida
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Paper Abstract

Accurate film thickness controls are indispensable for manufacturing defect-free semiconductor devices. Moreover, recent high integration requires simultaneous measurement of each film thickness and optical constants in multi-layers. This paper explains a microspectroscopic film thickness measurement system that measures film thickness at a very small spot (several micrometers in diameter) in several angstrom increments. This system also enables the user to measure film thickness on bulk wafers and SOI wafers, and determine optical constants of unknown films.

Paper Details

Date Published: 21 May 1996
PDF: 8 pages
Proc. SPIE 2725, Metrology, Inspection, and Process Control for Microlithography X, (21 May 1996); doi: 10.1117/12.240125
Show Author Affiliations
Masahiro Horie, Dai Nippon Screen Manufacturing Co., Ltd. (Japan)
Nariaki Fujiwara, Dai Nippon Screen Manufacturing Co., Ltd. (Japan)
Masahiko Kokubo, Dai Nippon Screen Manufacturing Co., Ltd. (Japan)
Hiroshi Kakiuchida, Dai Nippon Screen Manufacturing Co., Ltd. (Japan)


Published in SPIE Proceedings Vol. 2725:
Metrology, Inspection, and Process Control for Microlithography X
Susan K. Jones, Editor(s)

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