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Proceedings Paper

Prediction of light scattering characteristics of particles and structures on surfaces by the coupled-dipole method
Author(s): Brent Martin Nebeker; Roland Schmehl; Greg W. Starr; E. Dan Hirleman
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Paper Abstract

The ability to predict angle-resolved light scattering characteristics of surface features, including particle contaminants and circuit structures, is identified as an important tool for the development of next generation wafer inspection systems. A model and associated code based on the coupled-dipole method used to model the light scattering is described. Then, predicted scattering signatures for polystyrene latex spheres and silicon dioxide features (nominal 1 micrometer size) on smooth silicon surfaces are reported. The surface features of interest were from the ASU/SRC block of the SEMATECH Patterned Wafer Defect Standard die developed by VLSI Standards, Inc. Finally, the computational results are compared with scattering measurements from individual particles and features. A coherent beam incident of the features on the surface had a wavelength of 632.8 nm, 7 mm beam spot size, and was at an incident angle of 45 degrees. A ringed photodetector centered on the specular reflection was used to measure the angle-resolved scatter. Over the range of scattering angles studied (10 degrees to 60 degrees), the results for differential scattering cross-section agreed to within a factor of 3 or 4.

Paper Details

Date Published: 21 May 1996
PDF: 8 pages
Proc. SPIE 2725, Metrology, Inspection, and Process Control for Microlithography X, (21 May 1996); doi: 10.1117/12.240119
Show Author Affiliations
Brent Martin Nebeker, Arizona State Univ. (United States)
Roland Schmehl, Arizona State Univ. (United States)
Greg W. Starr, Arizona State Univ. (United States)
E. Dan Hirleman, Arizona State Univ. (United States)

Published in SPIE Proceedings Vol. 2725:
Metrology, Inspection, and Process Control for Microlithography X
Susan K. Jones, Editor(s)

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