Share Email Print
cover

Proceedings Paper

High-accuracy critical-dimension metrology using a scanning electron microscope
Author(s): Jeremiah R. Lowney; Andras E. Vladar; Michael T. Postek
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Two Monte Carlo computer codes have been written to simulate the transmitted-, backscattered-, and secondary-electron signals from targets in a scanning electron microscope. The first discussed, MONSEL-II, is applied to semi-infinite lines produced lithographically on multi-layer substrates. The second discussed, MONSEL-III, is an extension to fully three- dimensional targets. Results are given for a 1 micrometer step etched in a silicon substrate and compared with experimental data. The comparisons show that it is possible to obtain edge locations to an uncertainty of less than 10 nm. Simulations are also given for photoresist lines on a silicon substrate coated with a layer of photoresist. Techniques are developed for simulating signals for finite beam diameter from those for zero beam diameter, and for extracting signals approximating zero beam diameter from those with finite beam diameter.

Paper Details

Date Published: 21 May 1996
PDF: 12 pages
Proc. SPIE 2725, Metrology, Inspection, and Process Control for Microlithography X, (21 May 1996); doi: 10.1117/12.240108
Show Author Affiliations
Jeremiah R. Lowney, National Institute of Standards and Technology (United States)
Andras E. Vladar, NIST (United States)
Michael T. Postek, National Institute of Standards and Technology (United States)


Published in SPIE Proceedings Vol. 2725:
Metrology, Inspection, and Process Control for Microlithography X
Susan K. Jones, Editor(s)

© SPIE. Terms of Use
Back to Top