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Proceedings Paper

In-line overlay measurements for advanced photolithography
Author(s): Eric Rouchouze; Daniel Burlet; Jean Marc Dumant
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Paper Abstract

A set of analysis tools have been set-up to monitor and diagnose the overlay performances of a multi-stepper fab in a mix-and-match environment. A robust first order modeling and efficient software routines were designed for data transfer and processing. Global statistics, along with trend charts are presented. Process corrections and hardware upgrades can have their effects monitored. Lens-to-lens distortion difference and matching performances can also be evaluated.

Paper Details

Date Published: 21 May 1996
PDF: 14 pages
Proc. SPIE 2725, Metrology, Inspection, and Process Control for Microlithography X, (21 May 1996); doi: 10.1117/12.240094
Show Author Affiliations
Eric Rouchouze, SGS-Thomson (France)
Daniel Burlet, France Telecom CNET (France)
Jean Marc Dumant, France Telecom CNET (France)

Published in SPIE Proceedings Vol. 2725:
Metrology, Inspection, and Process Control for Microlithography X
Susan K. Jones, Editor(s)

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