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Proceedings Paper

Using optical pattern filtering defect inspection tools and process-induced defects per wafer pass for process defect control
Author(s): John R. Alvis; Michael J. Satterfield; Patricia Gabella
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Paper Abstract

A patterned wafer inspection system using optical pattern filtering (OPF) has been integrated into sub-half micron semiconductor device pilot production lines (125 mm and 200 mm) for the purpose of process defect control. The optical pattern filtering tool offers the advantages of 0.2 micrometer or better sensitivity with high throughput as compared to other patterned wafer inspection systems, and offers exceptional ability to find defects located deep inside the patterns of a typical device. This three dimensional capability offers unique capability when inspecting contacts or vias. A highly repetitive pattern must be used with the OPF tool. However, this limitation is easily overcome by using large highly repetitive arrays such as those found on DRAM or SRAM technologies. Additionally, the use of specially designed highly repetitive defect array masks such as a diffraction grating (comb) or a series of highly repetitive holes (vias and contacts) can be used.

Paper Details

Date Published: 21 May 1996
PDF: 16 pages
Proc. SPIE 2725, Metrology, Inspection, and Process Control for Microlithography X, (21 May 1996); doi: 10.1117/12.240086
Show Author Affiliations
John R. Alvis, Motorola (United States)
Michael J. Satterfield, Motorola (United States)
Patricia Gabella, Motorola (United States)

Published in SPIE Proceedings Vol. 2725:
Metrology, Inspection, and Process Control for Microlithography X
Susan K. Jones, Editor(s)

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