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Proceedings Paper

Wavelength division multiplexing using 3D interconnection structures
Author(s): David M. Reinker
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Paper Abstract

Semiconductor edge emitting lasers are passively aligned to polymeric waveguides on high thermal conductivity substrates. The single mode waveguides are combined to provide a high bandwidth wavelength division multiplexed channel. 3D stacks of the substrates are interconnected electrically and optically for further multiplexing.

Paper Details

Date Published: 1 May 1996
PDF: 10 pages
Proc. SPIE 2690, Wavelength Division Multiplexing Components, (1 May 1996); doi: 10.1117/12.238907
Show Author Affiliations
David M. Reinker, Irvine Sensors Corp. (United States)

Published in SPIE Proceedings Vol. 2690:
Wavelength Division Multiplexing Components
Louis S. Lome, Editor(s)

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