Share Email Print
cover

Proceedings Paper

Wavelength division multiplexing using 3D interconnection structures
Author(s): David M. Reinker
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Semiconductor edge emitting lasers are passively aligned to polymeric waveguides on high thermal conductivity substrates. The single mode waveguides are combined to provide a high bandwidth wavelength division multiplexed channel. 3D stacks of the substrates are interconnected electrically and optically for further multiplexing.

Paper Details

Date Published: 1 May 1996
PDF: 10 pages
Proc. SPIE 2690, Wavelength Division Multiplexing Components, (1 May 1996); doi: 10.1117/12.238907
Show Author Affiliations
David M. Reinker, Irvine Sensors Corp. (United States)


Published in SPIE Proceedings Vol. 2690:
Wavelength Division Multiplexing Components
Louis S. Lome, Editor(s)

© SPIE. Terms of Use
Back to Top