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Proceedings Paper

Polyimide films prepared by electrophoretic deposition and their dielectric breakdown
Author(s): Shuhei Nakamura; Kazuo Iida; Goro Sawa
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Paper Abstract

Electrophoretic deposition from non aqueous emulsion is one of the useful methods for forming polymer thin films selectively on metal electrodes. It has a potential to be used for forming an interdigital electrode for multilayer capacitor or actuator. A heat resistant polymer, polyimide (PI), film was prepared by the electrophoretic deposition method. Conductivity and dielectric strength were measured, comparing with casting and conventional PI films.

Paper Details

Date Published: 8 April 1996
PDF: 4 pages
Proc. SPIE 2780, Metal/Nonmetal Microsystems: Physics, Technology, and Applications, (8 April 1996); doi: 10.1117/12.238126
Show Author Affiliations
Shuhei Nakamura, Mie Univ. (Japan)
Kazuo Iida, Mie Univ. (Japan)
Goro Sawa, Mie Univ. (Japan)

Published in SPIE Proceedings Vol. 2780:
Metal/Nonmetal Microsystems: Physics, Technology, and Applications
Benedykt W. Licznerski; Andrzej Dziedzic, Editor(s)

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