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Proceedings Paper

Plastic-molded package of AlGaInP laser apparatus
Author(s): Hsing Chen; Rong-Yih Hwang; Jung-Tsung Hsu; Biing-Jye Lee
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Paper Abstract

A new apparatus is proposed for the package of AlGaInP visible laser diodes (LD) in this paper. Corresponding to the metal-can used in the conventional LD apparatus, plastics and lead-frame are used in this apparatus to reduce its cost. All the chip-mounting and wire- bonding for the apparatus are also modified to accord with the requirement of simplicity and good productivity. An lead-frame with a heat-dissipation tail is specially designed to overcome the poor heat-conductivity problem, which is observed in the common plastic-molded apparatus. The life time of the AlGaInP LD using the new plastic-molded apparatus is about five times longer than that using the common one.

Paper Details

Date Published: 10 April 1996
PDF: 8 pages
Proc. SPIE 2683, Fabrication, Testing, and Reliability of Semiconductor Lasers, (10 April 1996); doi: 10.1117/12.237690
Show Author Affiliations
Hsing Chen, Industrial Technology Research Institute (Taiwan)
Rong-Yih Hwang, Industrial Technology Research Institute (Taiwan)
Jung-Tsung Hsu, Industrial Technology Research Institute (Taiwan)
Biing-Jye Lee, Industrial Technology Research Institute (Taiwan)


Published in SPIE Proceedings Vol. 2683:
Fabrication, Testing, and Reliability of Semiconductor Lasers
Mahmoud Fallahi; S. C. Wang, Editor(s)

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