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Proceedings Paper

Fast in situ processing for multichip high density interconnects
Author(s): Patrik W. Hoffmann; M. Widmer; B. Lecohier; H. Solka; Hubert van den Bergh
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Paper Details

Date Published: 1 October 1990
PDF: 18 pages
Proc. SPIE 1352, 1st Intl School on Laser Surface Microprocessing, (1 October 1990); doi: 10.1117/12.23728
Show Author Affiliations
Patrik W. Hoffmann, Ecole Polytechnique Federale de Lausanne (Switzerland)
M. Widmer, Ecole Polytechnique Federale de Lausanne (Switzerland)
B. Lecohier, Ecole Polytechnique Federale de Lausanne (Switzerland)
H. Solka, Ecole Polytechnique Federale de Lausanne (Switzerland)
Hubert van den Bergh, Ecole Polytechnique Federale de Lausanne (Switzerland)


Published in SPIE Proceedings Vol. 1352:
1st Intl School on Laser Surface Microprocessing

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