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Proceedings Paper

Solder-paste/shape memory alloy composite for adaptive solder joint
Author(s): S. Trombert; Jean Chazelas; P. Bonniau; W. Van Moorleghem; M. Chandrasekaran; J. F. Silvain
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Paper Abstract

This paper analyzes briefly the different approaches to solve the problem of stresses generated by different thermal expansion coefficients, in brasing joints used to assemble high density electronic devices to printed circuit boards. While retaining certain ideas from some of the promising approaches, a novel approach to solve this problem is proposed in this report which involves developing a new composite solder paste containing superelastic alloy particles. Preliminary results obtained on Ni-coated NiTi wires embedded in a standard SnPb paste are reported which indicate that while the coated wires are wetted by the matrix, the adhesion between the coating and NiTi is poor. The behavior under tensile stresses have been simulated for NiTi particles incorporated composite pastes, each having a different particle volume fraction. Low strain value results show the decrease of the mean equivalent stress value when the volume fraction is increased.

Paper Details

Date Published: 26 April 1996
PDF: 6 pages
Proc. SPIE 2779, 3rd International Conference on Intelligent Materials and 3rd European Conference on Smart Structures and Materials, (26 April 1996); doi: 10.1117/12.237163
Show Author Affiliations
S. Trombert, Thomson-CSF (France)
Jean Chazelas, Thomson-CSF (France)
P. Bonniau, Thomson-CSF (France)
W. Van Moorleghem, AMT nv (Belgium)
M. Chandrasekaran, AMT nv (Belgium)
J. F. Silvain, ICMCB/CNRS (France)


Published in SPIE Proceedings Vol. 2779:
3rd International Conference on Intelligent Materials and 3rd European Conference on Smart Structures and Materials
Pierre Francois Gobin; Jacques Tatibouet, Editor(s)

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