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Proceedings Paper

MCM board level optical interconnects using passive polymer waveguides with hybrid optical and electrical multichip module packaging
Author(s): Julian P. G. Bristow; Yue Liu; Terry Marta; Klein Johnson; Brian R. Hanzal; Andrzej Peczalski; Sommy Bounnak; Yung-Sheng Liu; Herbert S. Cole
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Paper Abstract

Both multichip modules (MCMs) and optical interconnects are expected to play a pivotal role in the development of high performance electronic systems. Only by packaging optoelectronic components within the multichip modules can the advantages of both technologies be realized. We have demonstrated the incorporation of optoelectronic components into two different MCM technologies. In the first, we have used existing equipment and proven polymer materials to implement optoelectronic interfaces in a high density 'chip-first' technology. In the second, we have demonstrated optoelectronic packaging in 'chip-and-wire' packaging schemes. In both cases, the optical characteristics are compatible with commercial vertical cavity surface emitting lasers and optoelectronic receivers, allowing the implementation of practical MCM-to-MCM interconnects.

Paper Details

Date Published: 29 March 1996
PDF: 7 pages
Proc. SPIE 2691, Optoelectronic Packaging, (29 March 1996); doi: 10.1117/12.236922
Show Author Affiliations
Julian P. G. Bristow, Honeywell Technology Ctr. (United States)
Yue Liu, Honeywell Technology Ctr. (United States)
Terry Marta, Honeywell Technology Ctr. (United States)
Klein Johnson, Honeywell Technology Ctr. (United States)
Brian R. Hanzal, Honeywell Technology Ctr. (United States)
Andrzej Peczalski, Honeywell Technology Ctr. (United States)
Sommy Bounnak, Honeywell Technology Ctr. (United States)
Yung-Sheng Liu, GE Corporate Research and Development Ctr. (United States)
Herbert S. Cole, GE Corporate Research and Development Ctr. (United States)


Published in SPIE Proceedings Vol. 2691:
Optoelectronic Packaging
Michael R. Feldman; Yung-Cheng Lee, Editor(s)

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