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Proceedings Paper

Modeling VCSEL characteristics using device and package models
Author(s): Nina D. Morozova; Yung-Cheng Lee
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Paper Abstract

An integrated tool has been developed to predict how vertical cavity surface emitting laser (VCSEL) light output power is affected by packaging components. The set that has been developed includes modeling tools for devices and packages. The integrated tool can be useful for choosing an optimum specific package design for a VCSEL structure and to predict its characteristics in different packages under a variety of operating conditions. In this paper the integrated tool has been applied to study how VCSEL light output power is affected by different assembly technologies and packaging materials.

Paper Details

Date Published: 29 March 1996
PDF: 12 pages
Proc. SPIE 2691, Optoelectronic Packaging, (29 March 1996); doi: 10.1117/12.236920
Show Author Affiliations
Nina D. Morozova, Univ. of Colorado/Boulder (United States)
Yung-Cheng Lee, Univ. of Colorado/Boulder (United States)

Published in SPIE Proceedings Vol. 2691:
Optoelectronic Packaging
Michael R. Feldman; Yung-Cheng Lee, Editor(s)

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