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Proceedings Paper

Thermal considerations of free-space optical interconnects using VCSEL-based smart pixel arrays
Author(s): John A. Neff
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Paper Abstract

This paper discusses free-space optical interconnects from four perspectives: need, system architectures, major enabling technology, and component and system packaging. The need for such interconnection in telecommunication/datacommunication switching networks and fine- grained parallel computers is described. Since most of the envisioned systems fall into the two architectural classes of optical backplanes and 3-D systems, the paper describes these classes in detail. And the reader is introduced to the major enabling technology of smart pixel arrays. Finally, the paper describes attempts to implement free-space optical interconnect systems and some of the interesting thermal management issues that these implementations raise.

Paper Details

Date Published: 29 March 1996
PDF: 12 pages
Proc. SPIE 2691, Optoelectronic Packaging, (29 March 1996); doi: 10.1117/12.236917
Show Author Affiliations
John A. Neff, Univ. of Colorado/Boulder (United States)


Published in SPIE Proceedings Vol. 2691:
Optoelectronic Packaging
Michael R. Feldman; Yung-Cheng Lee, Editor(s)

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