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Proceedings Paper

Composition application protocol for AP interoperability
Author(s): Xiaolin Hou; Shensheng Zhang
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Paper Abstract

To support the requirement of concurrent engineering (CE), we need current STEP APs interpretable to integrate different applications in different phases of the entire lifetime cycle of a product. COMposition Application Protocols (COMAP) introduced and discussed in this paper is proposed to solve this problem. COMAP, serving as a root AP, is built on top of existing STEP APs for mapping information among them. A prototype of COMAP (cadpp) based on AP203 and AP224 for CAD/CAPP integration is implemented and discussed.

Paper Details

Date Published: 22 March 1996
PDF: 6 pages
Proc. SPIE 2644, Fourth International Conference on Computer-Aided Design and Computer Graphics, (22 March 1996); doi: 10.1117/12.235575
Show Author Affiliations
Xiaolin Hou, Shanghai Jiao Tong Univ. (China)
Shensheng Zhang, Shanghai Jiao Tong Univ. (China)

Published in SPIE Proceedings Vol. 2644:
Fourth International Conference on Computer-Aided Design and Computer Graphics
Shuzi Yang; Ji Zhou; Cheng-Gang Li, Editor(s)

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