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Proceedings Paper

Implementation study of an intelligent system for IC transfer molding process
Author(s): T. S Yeung; M. M. F. Yuen
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Paper Abstract

Various problems occurred in encapsulation of plastic IC packages are the results of improperly handling of the many process parameters, lack of understanding of material properties, and immature mold design. The traditional way to get rid of these problems is to adjust the process parameters of the transfer molding machine. However, the optimization of these parameters is usually based on past experiences or obtained by trial and error. This approach is time consuming and less accurate. A program is developed to help users to choose an appropriate initial machine setting based on the machine, material and mold design information. The detail of its application to IC encapsulation process is described in the paper.

Paper Details

Date Published: 22 March 1996
PDF: 6 pages
Proc. SPIE 2644, Fourth International Conference on Computer-Aided Design and Computer Graphics, (22 March 1996); doi: 10.1117/12.235561
Show Author Affiliations
T. S Yeung, Hong Kong Univ. of Science and Technology (Hong Kong)
M. M. F. Yuen, Hong Kong Univ. of Science and Technology (Hong Kong)


Published in SPIE Proceedings Vol. 2644:
Fourth International Conference on Computer-Aided Design and Computer Graphics
Shuzi Yang; Ji Zhou; Cheng-Gang Li, Editor(s)

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