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Proceedings Paper

Measuring defect depths by thermal-wave imaging
Author(s): Lawrence D. Favro; Xiaoyan Han; Pao-Kuang Kuo; Robert L. Thomas
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Paper Abstract

We describe a thermal wave technique for making defect depth determinations. Both theory and experiment are presented, and the results are compared. Examples of defects having different lateral dimensions and boundary conditions are given.

Paper Details

Date Published: 15 March 1996
PDF: 4 pages
Proc. SPIE 2766, Thermosense XVIII: An International Conference on Thermal Sensing and Imaging Diagnostic Applications, (15 March 1996); doi: 10.1117/12.235380
Show Author Affiliations
Lawrence D. Favro, Wayne State Univ. (United States)
Xiaoyan Han, Wayne State Univ. (United States)
Pao-Kuang Kuo, Wayne State Univ. (United States)
Robert L. Thomas, Wayne State Univ. (United States)


Published in SPIE Proceedings Vol. 2766:
Thermosense XVIII: An International Conference on Thermal Sensing and Imaging Diagnostic Applications
Douglas D. Burleigh; Jane W. Maclachlan Spicer, Editor(s)

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