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Proceedings Paper

Applications of Z-Plane memory technology to high-frame rate imaging systems
Author(s): Stuart N. Shanken; David E. Ludwig
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Paper Abstract

Z-Plane memory packaging technology utilizes the process of stacking integrated circuits (ICs) to each other in order to increase packaging density. This paper will discuss how Z-plane technology can be applied to memory systems used in high frame-rate imaging systems. 1.

Paper Details

Date Published: 1 January 1991
PDF: 6 pages
Proc. SPIE 1346, Ultrahigh- and High-Speed Photography, Videography, Photonics, and Velocimetry '90, (1 January 1991); doi: 10.1117/12.23350
Show Author Affiliations
Stuart N. Shanken, Irvine Sensors Corp. (United States)
David E. Ludwig, Irvine Sensors Corp. (United States)


Published in SPIE Proceedings Vol. 1346:
Ultrahigh- and High-Speed Photography, Videography, Photonics, and Velocimetry '90
Paul A. Jaanimagi; Barry T. Neyer; Larry L. Shaw, Editor(s)

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