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Proceedings Paper

High-density memory packaging technology high-speed imaging applications
Author(s): Dean L. Frew
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Paper Abstract

Advancements in image acquisition and processing technology are exceeding the capability of traditional magnetic tape recording. For scientific industrial and military applications a solid state high-density recording medium is required to store data generated at a rate of tens of Gigabits per second from moderate resolution high frame rate imagers. This paper discusses a three-dimensional (3-D) approach to memory packaging developed jointly by DARPA and Texas Instruments (TI). This packaging approach makes it feasible to economically produce a small rugged recorder for high speed solid state imaging applications. 1.

Paper Details

Date Published: 1 January 1991
PDF: 10 pages
Proc. SPIE 1346, Ultrahigh- and High-Speed Photography, Videography, Photonics, and Velocimetry '90, (1 January 1991); doi: 10.1117/12.23349
Show Author Affiliations
Dean L. Frew, Texas Instruments Inc. (United States)


Published in SPIE Proceedings Vol. 1346:
Ultrahigh- and High-Speed Photography, Videography, Photonics, and Velocimetry '90
Paul A. Jaanimagi; Barry T. Neyer; Larry L. Shaw, Editor(s)

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