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Proceedings Paper

From turning to grinding: ductile machining with gPVA
Author(s): C. Vogt; O. Fähnle; R. Rascher; M. Doetz; O. Dambon; F. Klocke
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Paper Abstract

Grinding processes are usually set up experimentally, product-specifically and iteratively. The selected parameters are often based on empirical values, whereby the user can set very different parameters and achieve similar results.

In 2017, the so called “grinding process validation approach” (gPVA) was introduced to determine suitable parameter windows. The method allows the definition of parameter windows for grinding tools and materials. Parameter adjustments for optimum results are possible due to the experimentally determined dependence on specific chip volume and tool pressure.

The system was originally developed to describe brittle grinding processes on standard grinding machines. Tests on an ultra-precision lathe provide process parameter data on ductile mode machining of tungsten carbide using UPM machines. This paper reports on gPVA being applied to transfer the ductile machining process from UPM machineries to a standard CNC grinding machine.

Paper Details

Date Published: 14 September 2018
PDF: 7 pages
Proc. SPIE 10742, Optical Manufacturing and Testing XII, 107420I (14 September 2018); doi: 10.1117/12.2323246
Show Author Affiliations
C. Vogt, Deggendorf Institute of Technology (Germany)
O. Fähnle, FISBA AG (Switzerland)
R. Rascher, Deggendorf Institute of Technology (Germany)
M. Doetz, Fraunhofer Institute for Production Technology IPT (Germany)
O. Dambon, Fraunhofer Institute for Production Technology IPT (Germany)
F. Klocke, Fraunhofer Institute for Production Technology IPT (Germany)

Published in SPIE Proceedings Vol. 10742:
Optical Manufacturing and Testing XII
Ray Williamson; Dae Wook Kim; Rolf Rascher, Editor(s)

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