Share Email Print
cover

Proceedings Paper

Wire-bond inspection in IC assembly
Author(s): Mandava Rajeswari; Mike G. Rodd
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Wire-bonding in IC assembly process involves making a physical connection between the IC 'die' and the 'lead' by bonding wires between the two. Inspection of wire-bond quality is a' highly labor-intensive process and currently efforts are being made to automate it. This paper presents the results of a research conducted into developing a comprehensive automated wire- bond visual inspection system that is capable of performing final accept/reject inspection, providing on-line process feedback, and assisting in process validation. The proposed inspection system consists of the inspection of the bond on a bond pad, the bond on a lead and the inter-connecting wire between a bond pad and its corresponding lead. The algorithms are based on simple and easily extractable features that ensure achieving the desired accuracy and speed. A novel but simple illumination system is proposed to obtain the images of the inter- connecting wires. The proposed system is validated using several state-of-the-art IC samples. This work is sponsored by the Ministry of Science Technology and Environment, Malaysia and Intel Technology Pvt. Ltd., Malaysia.

Paper Details

Date Published: 21 February 1996
PDF: 11 pages
Proc. SPIE 2665, Machine Vision Applications in Industrial Inspection IV, (21 February 1996); doi: 10.1117/12.232240
Show Author Affiliations
Mandava Rajeswari, Univ. of Science Malaysia (Malaysia)
Mike G. Rodd, Univ. of Wales Swansea (United Kingdom)


Published in SPIE Proceedings Vol. 2665:
Machine Vision Applications in Industrial Inspection IV
A. Ravishankar Rao; Ning Chang, Editor(s)

© SPIE. Terms of Use
Back to Top