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Proceedings Paper

Microstructure and low-temperature plastic deformation mechanisms of UFG copper
Author(s): V. Geidarov; T. Grigorova
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Paper Abstract

Ultrafine–grained copper was prepared by direct and equal-channel angular hydroextrusion. Tensile and stress relaxation tests were used to study the effect of microstructure on yield stress and strain-rate sensitivity of copper polycrystals in the insufficiently explored temperature range 4.2-295 K. Thermal activation analysis showed that in the range 77–200 K the rate of plastic deformation is controlled by the thermally activated mechanism of the forest dislocations intersection and its empirical parameters were obtained. Above 200 K the activation volume was decreased with the temperature increase. The inversion of the temperature dependence of the activation volume was attributed to the thermally activated detachment of dislocations from local pinning centers within the grain boundaries.

Paper Details

Date Published: 19 September 2018
PDF: 10 pages
Proc. SPIE 10730, Nanoengineering: Fabrication, Properties, Optics, and Devices XV, 107301G (19 September 2018); doi: 10.1117/12.2322124
Show Author Affiliations
V. Geidarov, Institute for Low Temperature Physics and Engineering (Ukraine)
T. Grigorova, Institute for Low Temperature Physics and Engineering (Ukraine)

Published in SPIE Proceedings Vol. 10730:
Nanoengineering: Fabrication, Properties, Optics, and Devices XV
Balaji Panchapakesan; Anne E. Sakdinawat; André-Jean Attias; Elizabeth A. Dobisz, Editor(s)

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