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Proceedings Paper

Laser packaging for single-mode fiber systems
Author(s): Kenneth K. Li
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Paper Abstract

Recently, the usage of long wavelength semiconductor lasers has slowly changed from R&D to manufacturing environments and from small to large volumes. The packaging of these laser diodes and appropriate automations become the driving force for low cost and high volume applications. In this paper, the packaging designs and material issues for single—mode fiber systems will be discussed. Furthermore, the trends for low-cost and high volume designs will be described. There are still many open issues in the packaging areas at this time. Some of the major ones will be addressed.

Paper Details

Date Published: 1 December 1992
Proc. SPIE 1582, Integrated Optoelectronics for Communication and Processing, (1 December 1992); doi: 10.1117/12.2321807
Show Author Affiliations
Kenneth K. Li, Arcadia (United States)

Published in SPIE Proceedings Vol. 1582:
Integrated Optoelectronics for Communication and Processing
C.-S. Hong, Editor(s)

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