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Mechanisms of resistance change under pressure for AgNP-based conducting wires
Author(s): Zhentao Qian; Liping Liu; Han Huang; Xiong Cheng; Xiaobo Zhu; Wenhua Gu
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Paper Abstract

The silver nanoparticle (AgNP) based conducting wire is a fundamental element of flexible electronic devices, especially in the printing electronics area. Its resistance change mechanisms under pressure is of both scientific interest and practical importance. AgNP-based conducting wires were fabricated on flexible substrates by electrospraying printing technology, and three possible resistance change mechanisms were studied: vertical deformation (VD) of the AgNP wire due to vertical pressure, horizontal wire elongation (HWE) along with the flexible substrate due to vertical pressure, and local micro deformation (LMD) at the touching edge. Analysis of the experiment data revealed that the resistance change due to VD was negligible, the resistance change due to PWE was one order of magnitude smaller than the measured value, and the resistance change due to PWE was the dominating mechanism.

Paper Details

Date Published: 20 February 2018
PDF: 8 pages
Proc. SPIE 10697, Fourth Seminar on Novel Optoelectronic Detection Technology and Application, 106974Z (20 February 2018); doi: 10.1117/12.2315465
Show Author Affiliations
Zhentao Qian, Nanjing Univ. of Science and Technology (China)
Liping Liu, Rutgers Univ. (United States)
Han Huang, Nanjing Univ. of Science and Technology (China)
Xiong Cheng, Nanjing Univ. of Science and Technology (China)
Xiaobo Zhu, Nanjing Univ. of Science and Technology (China)
Wenhua Gu, Nanjing Univ. of Science and Technology (China)


Published in SPIE Proceedings Vol. 10697:
Fourth Seminar on Novel Optoelectronic Detection Technology and Application
Weiqi Jin; Ye Li, Editor(s)

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