Share Email Print
cover

Proceedings Paper • Open Access

Non destructive examination of interface of molecular assembly
Author(s): Guy Perez; Isaline Richard; Jean-Claude Lecomte

Paper Abstract

Molecular assembly interfaces can be characterised by mechanical testing and/or the interaction between waves and the interface. The disadvantage of the mechanical approach is that new defects may be produced at the interface, or existing defects may be destroyed.

Using the interaction between waves and the interface is a non-destructive approach. But what kind of waves should be used? Electromagnetic waves in the visible range depend on wave attenuation in the material, infrared waves also depend on the thickness and X-ray waves have a too short a wave length to detect interface defects. In this article, the use of acoustic waves is proposed for non-destructive examination of molecular assembly interfaces.

Acoustic wave propagation is very sensitive to variations in interface characteristics depending on whether the waves are reflected or transmitted. To improve the sensitivity and resolution of this technique, small wave lengths have been used with a scanning acoustic microscope (S.A.M.) with a band width from 1MHz to 400 MHz. After a short description of the principle of the method, results are given for different types of components. Different applications of acoustic microscopy are proposed for non-destructive examination of interfaces and defect detection in materials.

Paper Details

Date Published: 21 November 2017
PDF: 6 pages
Proc. SPIE 10569, International Conference on Space Optics — ICSO 2000, 105691P (21 November 2017); doi: 10.1117/12.2307920
Show Author Affiliations
Guy Perez, Ctr. National d'Études Spatiales (France)
Isaline Richard, INSIDIX (France)
Jean-Claude Lecomte, INSIDIX (France)


Published in SPIE Proceedings Vol. 10569:
International Conference on Space Optics — ICSO 2000
Georges Otrio, Editor(s)

© SPIE. Terms of Use
Back to Top