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Circuits-electromagnetics co-design: a new paradigm for silicon-based THz systems-on-chip
Author(s): Kaushik Sengupta; Xue Wu
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Paper Abstract

Silicon-based integrated circuit technology provides a great platform for enabling compact, efficient, low-power, chipscale THz systems for new applications in sensing, imaging and communication. This is partially facilitated by scaling that has pushed device cut-off frequencies (ft, fmax) up into the sub-THz and THz frequency range, the true paradigm shift in silicon integration is that it provides a unique opportunity to enable a field of active THz electromagnetics realizable through a circuits-EM-systems co-design approach. At these frequencies, the chip dimension is comparable to THz wavelengths which allows novel scattering and radiating properties in a substrate that simultaneously supports a billion high-frequency transistors that can generate, process and sense these signals. The ability to actively synthesize, manipulate and sense THz EM fields at sub-wavelength scales with circuits opens up a new design space for THz electronics. THz architectures emerging from this space are often multi-functional, reconfigurable and break many of the classical trade-offs of a partitioned design approach. This paper provides examples to illustrate this design methodology on THz signal generation with dynamic waveform shaping and THz spectrum sensing.

Paper Details

Date Published: 11 May 2018
PDF: 10 pages
Proc. SPIE 10634, Passive and Active Millimeter-Wave Imaging XXI, 106340G (11 May 2018); doi: 10.1117/12.2305522
Show Author Affiliations
Kaushik Sengupta, Princeton Univ. (United States)
Xue Wu, Princeton Univ. (United States)

Published in SPIE Proceedings Vol. 10634:
Passive and Active Millimeter-Wave Imaging XXI
David A. Wikner; Duncan A. Robertson, Editor(s)

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