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Development of A Hermetically Packaged 13µm Pixel Pitch 6000-Element InGaAs Linear Array
Author(s): Kai Song; Jih-Fen Lei; Anders Peterson; Henry Yuan; Jongwoo Kim; Joe Kimchi; Vincent Douence; Brian Starr; Venkataraman Sundareswaran; James W. Beletic
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Paper Abstract

In this paper, we present the test results of a flight-grade 13μm pixel pitch 6000-element 1.7μm InGaAs linear array in a hermetic package, designed and developed for space remote sensing and imaging applications. The array consists of a single 13μm pixel pitch 6000-element InGaAs linear array and a custom single digital 2.0 Mecapacitance trans-impedance amplifier (CTIA) readout integrated circuit (ROIC) with four gains. We have achieved greater than 80% peak quantum efficiency and higher than 1100 signal-to-noise ratio (SNR) at 90% well fill. The focal plane array is in a vacuum hermatically sealed package with an anti-reflective (AR)-coated Sapphire window and 29 pins, including four for low voltage differential signaling (LVDS) outputs.

Paper Details

Date Published: 14 May 2018
PDF: 8 pages
Proc. SPIE 10656, Image Sensing Technologies: Materials, Devices, Systems, and Applications V, 106560K (14 May 2018); doi: 10.1117/12.2305374
Show Author Affiliations
Kai Song, Teledyne Judson Technologies (United States)
Jih-Fen Lei, Teledyne Judson Technologies (United States)
Anders Peterson, Teledyne Imaging Sensors (United States)
Henry Yuan, Teledyne Judson Technologies (United States)
Jongwoo Kim, Teledyne Judson Technologies (United States)
Joe Kimchi, Teledyne Judson Technologies (United States)
Vincent Douence, Teledyne Imaging Sensors (United States)
Brian Starr, Teledyne Imaging Sensors (United States)
Venkataraman Sundareswaran, Teledyne Scientific Company (United States)
James W. Beletic, Teledyne Imaging Sensors (United States)

Published in SPIE Proceedings Vol. 10656:
Image Sensing Technologies: Materials, Devices, Systems, and Applications V
Nibir K. Dhar; Achyut K. Dutta, Editor(s)

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