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Implementation of SOI diode uncooled IRFPA in TEC-less and shutter-less operation
Author(s): D. Fujisawa; Y. Kosasayama; T. Takikawa; H. Hata; T. Takenaga; T. Satake; K. Yamashita; D. Suzuki
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Paper Abstract

We develop a shutter-less method for replacing mechanical shutters. To verify the effectiveness of the proposed method, we fabricated a silicon-on-insulator (SOI) diode uncooled 320 × 240 infrared focal plane array (IRFPA) with 17 μm pixel pitch utilizing a circuit architecture that achieves thermo-electric cooling (TEC)-less operation. Furthermore, we fabricated a prototype uncooled IR camera that implements the proposed method and verified favorable camera operation. The temperature behavior of our proposed SOI diode is highly uniform and predictable, which enables simpler device modeling and consequently simpler TEC-less and shutter-less operation.

Paper Details

Date Published: 29 May 2018
Proc. SPIE 10624, Infrared Technology and Applications XLIV, 1062421 (29 May 2018); doi: 10.1117/12.2305165
Show Author Affiliations
D. Fujisawa, Mitsubishi Electric Corp. (Japan)
Y. Kosasayama, Mitsubishi Electric Corp. (Japan)
T. Takikawa, Mitsubishi Electric Corp. (Japan)
H. Hata, Mitsubishi Electric Corp. (Japan)
T. Takenaga, Mitsubishi Electric Corp. (Japan)
T. Satake, Mitsubishi Electric Corp. (Japan)
K. Yamashita, Mitsubishi Electric Corp. (Japan)
D. Suzuki, Mitsubishi Electric Corp. (Japan)

Published in SPIE Proceedings Vol. 10624:
Infrared Technology and Applications XLIV
Bjørn F. Andresen; Gabor F. Fulop; Charles M. Hanson; John Lester Miller; Paul R. Norton, Editor(s)

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