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Proceedings Paper

Hemispherical image sensor development for wide FOV imaging
Author(s): Zhao Ma; C. Kyle Renshaw
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Paper Abstract

Curved image sensors offer a new degree of freedom in optical system design that promise low-cost, small-volume solutions for wide field-of-view imaging. Stretchable polymer backplanes can provide the high-density of interconnects and tolerate the large deformations needed to transform planar, wafer-based image sensors into shapes with large nonzero Gaussian curvature. Here we demonstrate a thermoformable backplane based on glycolated polyethylene terephthalate (PETg) that can be deformed to a 98° spherical cap with 0.5” radius. We introduce a process to integrate such backplanes with a CMOS image sensor and release the circuit from the wafer to form a monolithically integrated image sensor that can be thermoformed to the desired shape.

Paper Details

Date Published: 14 May 2018
PDF: 5 pages
Proc. SPIE 10656, Image Sensing Technologies: Materials, Devices, Systems, and Applications V, 106561Q (14 May 2018); doi: 10.1117/12.2305051
Show Author Affiliations
Zhao Ma, CREOL, The College of Optics and Photonics, Univ. of Central Florida (United States)
C. Kyle Renshaw, CREOL, The College of Optics and Photonics, Univ. of Central Florida (United States)
Univ. of Central Florida (United States)


Published in SPIE Proceedings Vol. 10656:
Image Sensing Technologies: Materials, Devices, Systems, and Applications V
Nibir K. Dhar; Achyut K. Dutta, Editor(s)

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