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Proceedings Paper • Open Access

High-throughput optical inter-board interconnects for next-generation on-board digital transparent processors
Author(s): N. Venet; M. Sotom; H. Gachon; V. Foucal; M. Pez; V. Heikkinen; T. Tuominen; S. Pantoja

Paper Abstract

The satellite telecommunication sector is continuously facing new challenges. Operators turn towards increasing capacity payloads with higher number of beams and broader bandwidth, in order to cope with exhausting orbital positions and to lower the cost of in-orbit delivery of bit. Only satellites able to provide high data rate connections to numerous users are expected to achieve affordable communication prices. On the other hand, as the telecom market grows and the range of offered services (HDTV, Video On Demand, Triple Play), operators call for more versatile solutions to quickly grasp new markets and to adapt to these evolutions over the average 15 years of a satellite lifetime.

Flexible payloads have found an increasing interest for a number of years. Flexibility is considered as a means for a better commercial exploitation of a satellite fleet and a better allocation of resource in response to traffic evolution and/or changing business plans, with potential advantages such as a wider range of applications, less customization for specific missions, increased production runs of equipment, enhancement of reliability, reduction of equipment cost, reduction of program schedules [1]. Flexibility is expected to be offered in spectrum management and frequency plan, in coverage, or in the repeater power allocation.

The industry is taking up the challenge both by improving current telecom satellites and offering new payload technology, more flexible and able to address the new markets. From a system integrator perspective, flexibility is as an opportunity to design more generic payloads, that can be customized during or after fabrication only, thus shortening the design-to-manufacturing cycle, and improving the industry competitiveness.

Paper Details

Date Published: 17 November 2017
PDF: 9 pages
Proc. SPIE 10563, International Conference on Space Optics — ICSO 2014, 1056337 (17 November 2017); doi: 10.1117/12.2304235
Show Author Affiliations
N. Venet, Thales Alenia Space (France)
M. Sotom, Thales Alenia Space (France)
H. Gachon, Thales Alenia Space (France)
V. Foucal, D-Lightsys, Radiall (France)
M. Pez, D-Lightsys, Radiall (France)
V. Heikkinen, VTT (Finland)
T. Tuominen, Patria (Finland)
S. Pantoja, Das-Photonics (Spain)


Published in SPIE Proceedings Vol. 10563:
International Conference on Space Optics — ICSO 2014
Zoran Sodnik; Bruno Cugny; Nikos Karafolas, Editor(s)

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