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Proceedings Paper

Object-oriented visual-inspection tool for ultrafine-pitch SMD components
Author(s): Ismail Fidan; Larry Ruff; Stephen Derby
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Paper Abstract

Surface mount devices (SMDs), a dominant component type on printed circuit boards these days, are becoming smaller and growing more leads. This is in response to the shrinking of electronic components that is necessary for smaller electronic tools. The trend toward ever smaller components makes component leads more fragile and makes packages harder to handle. As a result, lead inspection has become more crucial than ever before. This paper includes a description of the object-oriented visual inspection tool (OOVIT) development for fine-pitch SMD components and its final structure.

Paper Details

Date Published: 19 January 1996
PDF: 11 pages
Proc. SPIE 2599, Three-Dimensional and Unconventional Imaging for Industrial Inspection and Metrology, (19 January 1996); doi: 10.1117/12.230391
Show Author Affiliations
Ismail Fidan, Rensselaer Polytechnic Institute (United States)
Larry Ruff, Rensselaer Polytechnic Institute (United States)
Stephen Derby, Rensselaer Polytechnic Institute (United States)

Published in SPIE Proceedings Vol. 2599:
Three-Dimensional and Unconventional Imaging for Industrial Inspection and Metrology
Michael R. Descour; Kevin G. Harding; Donald J. Svetkoff, Editor(s)

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