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Proceedings Paper

3D line-scan imaging with orthogonal symmetry
Author(s): Donald J. Svetkoff; Donald B.T. Kilgus; Robert C. Boman
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Paper Abstract

Three-dimensional imaging systems may be configured to provide a high figure of merit based upon speed, accuracy, and cost. Typically the object is imaged with a line scan arrangement which, depending upon the application, may have disadvantages of lack of symmetry and associated constraints imposed by directional illumination and viewing. Furthermore, a potential compromise often exists between scan efficiency and accuracy caused by unnecessary data acquisition in regions not containing information of interest. This paper illustrates a method for 3D scanning in a non-orthogonal system, particularly applicable for inspection of micro-electronic circuits and patterns, which mitigates the above mentioned tradeoffs. The use of optimized scanning patterns with high speed, addressable beam deflectors is discussed. Improvements associated with the imaging system are quantified with respect to standard line scan configurations at similar pixel rates.

Paper Details

Date Published: 19 January 1996
PDF: 12 pages
Proc. SPIE 2599, Three-Dimensional and Unconventional Imaging for Industrial Inspection and Metrology, (19 January 1996); doi: 10.1117/12.230377
Show Author Affiliations
Donald J. Svetkoff, View Engineering, Inc. (United States)
Donald B.T. Kilgus, View Engineering, Inc. (United States)
Robert C. Boman, View Engineering, Inc. (United States)


Published in SPIE Proceedings Vol. 2599:
Three-Dimensional and Unconventional Imaging for Industrial Inspection and Metrology
Michael R. Descour; Kevin G. Harding; Donald J. Svetkoff, Editor(s)

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