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Proceedings Paper

Optical system of an industrial 3D laser scanner for solder paste inspection
Author(s): Jef L. Horijon; Willem D. van Amstel; Fred C. M. Couweleers; Wilco C.A. Ligthart
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Paper Abstract

A new industrial 3D laser scanner is presented for measurement of solder paste screening quality in an automated PCB assembly line. Its unique scan optics provide telecentric illumination and imaging on a long scan line of 305 mm (12') at a maximum rate of more than 1000 scans per second. Synchronized height measurement is performed using a double triangulation scheme at large angles and wide aperture by means of a confocal like design based on elliptical mirrors. Using a spot size of 20 micrometers multiplied by 30 micrometers (FWHM), lateral resolution can be set electronically down to 10 micrometers pixel size. Depth resolution is 10 micrometers over a 2.5 mm measuring range. Combined with accurate and fast processing and control electronics this 3D sensor enables full 100% inspection at production speed.

Paper Details

Date Published: 19 January 1996
PDF: 9 pages
Proc. SPIE 2599, Three-Dimensional and Unconventional Imaging for Industrial Inspection and Metrology, (19 January 1996); doi: 10.1117/12.230375
Show Author Affiliations
Jef L. Horijon, Philips Ctr. for Manufacturing Technology (Netherlands)
Willem D. van Amstel, Philips Ctr. for Manufacturing Technology (Netherlands)
Fred C. M. Couweleers, Philips Ctr. for Manufacturing Technology (Netherlands)
Wilco C.A. Ligthart, Philips Ctr. for Manufacturing Technology (Netherlands)


Published in SPIE Proceedings Vol. 2599:
Three-Dimensional and Unconventional Imaging for Industrial Inspection and Metrology
Michael R. Descour; Kevin G. Harding; Donald J. Svetkoff, Editor(s)

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