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Proceedings Paper

In-depth analysis and characterization of a dual damascene process with respect to different CD
Author(s): Gerd Krause; Detlef Hofmann; Boris Habets; Stefan Buhl; Manuela Gutsch; Alberto Lopez-Gomez; Wan-Soo Kim; Xaver Thrun
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Paper Abstract

In a 200 mm high volume environment, we studied data from a dual damascene process. Dual damascene is a combination of lithography, etch and CMP that is used to create copper lines and contacts in one single step. During these process steps, different metal CD are measured by different measurement methods. In this study, we analyze the key numbers of the different measurements after different process steps and develop simple models to predict the electrical behavior* . In addition, radial profiles have been analyzed of both inline measurement parameters and electrical parameters. A matching method was developed based on inline and electrical data. Finally, correlation analysis for radial signatures is presented that can be used to predict excursions in electrical signatures.

Paper Details

Date Published: 13 March 2018
PDF: 18 pages
Proc. SPIE 10585, Metrology, Inspection, and Process Control for Microlithography XXXII, 105852T (13 March 2018); doi: 10.1117/12.2302971
Show Author Affiliations
Gerd Krause, Infineon Technologies Dresden (Germany)
Detlef Hofmann, Infineon Technologies Dresden (Germany)
Boris Habets, Qoniac GmbH (Germany)
Stefan Buhl, Qoniac GmbH (Germany)
Manuela Gutsch, Qoniac GmbH (Germany)
Alberto Lopez-Gomez, Qoniac GmbH (Germany)
Wan-Soo Kim, Qoniac GmbH (Germany)
Xaver Thrun, Qoniac GmbH (Germany)


Published in SPIE Proceedings Vol. 10585:
Metrology, Inspection, and Process Control for Microlithography XXXII
Vladimir A. Ukraintsev, Editor(s)

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