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Proceedings Paper

Automation of IRFPA production processes
Author(s): James Egerton; Nancy Dieselman; William M. Higgins; Peter H. Zimmermann; Ashok Sood
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Paper Abstract

This paper examines three applications of automation technology in the manufacture of Infrared Focal Plane arrays. Areas to be examined ar wafer handling during array fabrication up through dicing, automation ofLiquid Phase Epitaxy, and automation of bump bonding. The collection of factory data and its use in control of the manufacturing process will also be discussed. Specifics related to the production of Z-module architecture will be emphasized.

Paper Details

Date Published: 1 November 1990
PDF: 11 pages
Proc. SPIE 1339, Materials, Devices, Techniques, and Applications for Z-Plane Focal Plane Array Technology II, (1 November 1990); doi: 10.1117/12.23026
Show Author Affiliations
James Egerton, Loral Infrared and Imaging Systems (United States)
Nancy Dieselman, Loral Infrared and Imaging Systems (United States)
William M. Higgins, Loral Infrared and Imaging Systems (United States)
Peter H. Zimmermann, Loral Infrared and Imaging Systems (United States)
Ashok Sood, Loral Infrared and Imaging Systems (United States)


Published in SPIE Proceedings Vol. 1339:
Materials, Devices, Techniques, and Applications for Z-Plane Focal Plane Array Technology II
John C. Carson, Editor(s)

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