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Proceedings Paper

128-layer HYMOSS-module fabrication issues
Author(s): David E. Ludwig
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Paper Abstract

The fabrication of the first Z-technology module with 128 active layers of readout electronic circuitry is being pursued. Several issues which will be investigated regarding the 128-layer module build, such as photolithographic processing at the edge of the module (edge effects) and module buttability, are discussed in this paper. Other topics which are covered apply to future applications of fully populated HYMOSS modules. These topics include possible reductions of thermal mass for quick cool-down time applications and improvements of end-to-end yield for low-cost applications.

Paper Details

Date Published: 1 November 1990
PDF: 6 pages
Proc. SPIE 1339, Materials, Devices, Techniques, and Applications for Z-Plane Focal Plane Array Technology II, (1 November 1990); doi: 10.1117/12.23025
Show Author Affiliations
David E. Ludwig, Irvine Sensors Corp. (United States)


Published in SPIE Proceedings Vol. 1339:
Materials, Devices, Techniques, and Applications for Z-Plane Focal Plane Array Technology II
John C. Carson, Editor(s)

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