Share Email Print
cover

Proceedings Paper

Putting the automation in tape automated bonding
Author(s): William C. Whitworth
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Tape automated bonding processes have been adapted to the development of a fully automated cell. Details of the early cell design and planning are presented, including a discussion of reliability and producibility advantages achievable from the cell and some early problems encountered in the development. Test results from the first demonstration modules are presented along with projections for results considered achievable with the automated cell.

Paper Details

Date Published: 1 November 1990
PDF: 9 pages
Proc. SPIE 1339, Materials, Devices, Techniques, and Applications for Z-Plane Focal Plane Array Technology II, (1 November 1990); doi: 10.1117/12.23022
Show Author Affiliations
William C. Whitworth, Grumman Aerospace Corp. (United States)


Published in SPIE Proceedings Vol. 1339:
Materials, Devices, Techniques, and Applications for Z-Plane Focal Plane Array Technology II
John C. Carson, Editor(s)

© SPIE. Terms of Use
Back to Top