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Proceedings Paper

Space/performance qualification of the tape automated bonded devices
Author(s): Omkarnath K. Gupta; James J. Knight
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Paper Abstract

Quality assurance, wafer lot production, device testing, postprobe processing, and qualification and quality screening of tape automated bonded devices are discussed. These devices are qualifed for space applications and ready to assemble directly into production modules.

Paper Details

Date Published: 1 November 1990
PDF: 8 pages
Proc. SPIE 1339, Materials, Devices, Techniques, and Applications for Z-Plane Focal Plane Array Technology II, (1 November 1990); doi: 10.1117/12.23021
Show Author Affiliations
Omkarnath K. Gupta, Amber Engineering, Inc. (United States)
James J. Knight, Amber Engineering, Inc. (United States)


Published in SPIE Proceedings Vol. 1339:
Materials, Devices, Techniques, and Applications for Z-Plane Focal Plane Array Technology II
John C. Carson, Editor(s)

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