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Proceedings Paper

Current HYMOSS Z-technology overview
Author(s): David E. Ludwig
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Paper Abstract

This paper provides an overview of the current state-of-the-art HYMOSS (Hybrid Mosaic On Stacked Silicon) Z-technology. In the first part of this paper, an introduction to the HYMOSS physical characteristics is presented. This includes a description of the stacked substrates (cube) and mounting hardware (module). The basic steps in manufacturing HYMOSS are covered. The paper concludes with a description of the two newest endeavors for HYMOSS technology: stacking of superconducting ICs, digital memory, and processor ICs.

Paper Details

Date Published: 1 November 1990
PDF: 9 pages
Proc. SPIE 1339, Materials, Devices, Techniques, and Applications for Z-Plane Focal Plane Array Technology II, (1 November 1990); doi: 10.1117/12.23017
Show Author Affiliations
David E. Ludwig, Irvine Sensors Corp. (United States)


Published in SPIE Proceedings Vol. 1339:
Materials, Devices, Techniques, and Applications for Z-Plane Focal Plane Array Technology II
John C. Carson, Editor(s)

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