Share Email Print

Proceedings Paper

Investigation of techniques for minimizing resistivity of thin metallic films at submillimeter wavelengths
Author(s): K. S. Schieuer
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Experimental investigations of the substrate deposition temperature and annealing temperature influence on aluminum films deposited on diamond substrates were conducted. Tests were performed at direct current and at 101.55 GHz. Minimum resistivity levels, near theoretical predictions, occurred for deposition temperatures in the range of 50-160°C and for peak annealing temperatures of 100-120°C. Both colder and hotter substrate temperatures resulted in larger resistivity levels.

Paper Details

Date Published: 1 December 1990
PDF: 3 pages
Proc. SPIE 1514, 15th International Conference on Infrared and Millimeter Waves, 151421 (1 December 1990); doi: 10.1117/12.2301483
Show Author Affiliations
K. S. Schieuer, Univ. of Utah (United States)

Published in SPIE Proceedings Vol. 1514:
15th International Conference on Infrared and Millimeter Waves
Richard J. Temkin, Editor(s)

© SPIE. Terms of Use
Back to Top