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Proceedings Paper

Modeling of electron-specimen interaction in scanning electron microscope for e-beam metrology and inspection: challenges and perspectives
Author(s): Makoto Suzuki; Toshimasa Kameda; Ayumi Doi; Sergey Borisov; Sergey Babin
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Paper Abstract

The interpretation of scanning electron microscopy (SEM) images of the latest semiconductor devices is not intuitive and requires comparison with computed images based on theoretical modeling and simulations. For quantitative image prediction and geometrical reconstruction of the specimen structure, the accuracy of the physical model is essential. In this paper, we review the current models of electron-solid interaction and discuss their accuracy. We perform the comparison of the simulated results with our experiments of SEM overlay of under-layer, grain imaging of copper interconnect, and hole bottom visualization by angular selective detectors, and show that our model well reproduces the experimental results. Remaining issues for quantitative simulation are also discussed, including the accuracy of the charge dynamics, treatment of beam skirt, and explosive increase in computing time.

Paper Details

Date Published: 13 March 2018
PDF: 14 pages
Proc. SPIE 10585, Metrology, Inspection, and Process Control for Microlithography XXXII, 1058517 (13 March 2018); doi: 10.1117/12.2301383
Show Author Affiliations
Makoto Suzuki, Hitachi High-Technologies Corp. (Japan)
Toshimasa Kameda, Hitachi High-Technologies Corp. (Japan)
Ayumi Doi, Hitachi High-Technologies Corp. (Japan)
Sergey Borisov, aBeam Technologies, Inc. (United States)
Sergey Babin, aBeam Technologies, Inc. (United States)

Published in SPIE Proceedings Vol. 10585:
Metrology, Inspection, and Process Control for Microlithography XXXII
Vladimir A. Ukraintsev, Editor(s)

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