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Proceedings Paper

Silicon wafer board alignment of laser arrays to single-mode optical fiber for analog optoelectronic module applications
Author(s): Paul O. Haugsjaa; Craig A. Armiento; Andrew J. Negri; Joseph Mehr; Marvin J. Tabasky; Hui Pin Hsu; Willie W. Ng; Daniel Yap; Huan-Wun Yen
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Paper Abstract

This paper describes the development of laser transmitter arrays for analog optoelectronic link applications up to 2 GHz. These modules have been developed in an attempt to utilize passive assembly and alignment operations for the purpose of reducing costs. To this end, silicon waferboard integration platforms and semiconductor laser arrays have been fabricated with special alignment features that allow passive assembly of flip-chip laser arrays to single-mode optical fiber arrays.

Paper Details

Date Published: 15 January 1996
PDF: 9 pages
Proc. SPIE 2610, Laser Diode Chip and Packaging Technology, (15 January 1996); doi: 10.1117/12.230078
Show Author Affiliations
Paul O. Haugsjaa, GTE Labs. Inc. (United States)
Craig A. Armiento, GTE Labs. Inc. (United States)
Andrew J. Negri, GTE Labs. Inc. (United States)
Joseph Mehr, GTE Labs. Inc. (United States)
Marvin J. Tabasky, GTE Labs. Inc. (United States)
Hui Pin Hsu, Hughes Research Labs. (United States)
Willie W. Ng, Hughes Research Labs. (United States)
Daniel Yap, Hughes Research Labs. (United States)
Huan-Wun Yen, Hughes Research Labs. (United States)


Published in SPIE Proceedings Vol. 2610:
Laser Diode Chip and Packaging Technology
Pei Chuang Chen; Tomas D. Milster, Editor(s)

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