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Proceedings Paper

Packaging of photonic devices using laser welding
Author(s): Soon Jang
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Paper Abstract

Pulsed laser welding has proven to be the preferred bonding method that best facilitates the automated fiber alignment and bonding process of optoelectronic devices. However, a combination of considerations regarding (1) the high capital investment for a laser welding workstation (LWWS), (2) acquiring and developing the packaging technology for laser welding, and (3) the undeveloped demand in the market place have caused hesitation by many manufacturers in adopting the process. Typically, the majority of packages manufactured with laser welding have been higher-end priced devices. Further understanding and improvement of technical challenges, such as 'post-weld-shift' control, material selection, and package design, along with development of a cost-effective semi-automated LWWS are presenting a greater opportunity for a broader range of packages to be designed for laser welding, especially for low-cost singlemode datacom packages. The focus of the current work is to design a broad range of OE packages and develop a nanometer precision automation process for laser welding technology. The solution is recognized to be the combination of understanding the laser welding process, designing packages for laser welding, and developing an automation capability for manufacturing.

Paper Details

Date Published: 15 January 1996
PDF: 12 pages
Proc. SPIE 2610, Laser Diode Chip and Packaging Technology, (15 January 1996); doi: 10.1117/12.230077
Show Author Affiliations
Soon Jang, Newport Corp. (United States)


Published in SPIE Proceedings Vol. 2610:
Laser Diode Chip and Packaging Technology
Pei Chuang Chen; Tomas D. Milster, Editor(s)

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