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Proceedings Paper

Uncooled laser packaging based on silicon optical bench technology
Author(s): John V. Gates; G. Henein; Joseph Shmulovich; Dirk J. Muehlner; W. Michael MacDonald; Ronald E. Scotti
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Paper Abstract

Local access fiber optic systems and distributed gain fiber amplifier systems require low-cost and highly stable laser diode packages with high coupling efficiencies. These systems may use uncooled packaged lasers from the central office to the subscriber units in discrete or integrated transceiver packages. Low cost and high volume manufacturing technologies must be developed in order to produce these laser packages. A simple alternative to existing technologies is described in this paper. AT&T Bell Laboratories has been developing silicon optical bench (SiOB) technology for use as an integrated packaging platform for lasers, photodetectors and passive optical components. In this paper we describe an integrated optical sub-assembly for use in high volume and low cost laser packaging. The assembly integrates bond sites for a laser, a backface monitor photodetector and a metallized lensed fiber onto a single silicon optical sub-assembly. The approach allows for low cost batch processing, assembly and testing of components using the silicon wafer as a carrier and the use of automated pick and place machines for assembly.

Paper Details

Date Published: 15 January 1996
PDF: 11 pages
Proc. SPIE 2610, Laser Diode Chip and Packaging Technology, (15 January 1996); doi: 10.1117/12.230076
Show Author Affiliations
John V. Gates, AT&T Bell Labs. (United States)
G. Henein, AT&T Bell Labs. (United States)
Joseph Shmulovich, AT&T Bell Labs. (United States)
Dirk J. Muehlner, AT&T Bell Labs. (United States)
W. Michael MacDonald, AT&T Bell Labs. (United States)
Ronald E. Scotti, AT&T Bell Labs. (United States)


Published in SPIE Proceedings Vol. 2610:
Laser Diode Chip and Packaging Technology
Pei Chuang Chen; Tomas D. Milster, Editor(s)

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