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Proceedings Paper

Materials challenges for repeatable RF wireless device reconfiguration with microfluidic channels
Author(s): Anthony S. Griffin; Nancy R. Sottos; Scott R. White
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Paper Abstract

Recently, adaptive wireless devices have utilized displacement of EGaIn within microchannels as an electrical switching mechanism to enable reconfigurable electronics. Device reconfiguration using EGaIn in microchannels overcomes many challenges encountered by more traditional reconfiguration mechanisms such as diodes and microelectromechanical systems (MEMS). Reconfiguration using EGaIn is severely limited by undesired permanent shorting due to retention of the liquid in microchannels caused by wetting and rapid oxide skin formation. Here, we investigate the conditions which prevent repeatable electrical switching using EGaIn in microchannels. Initial contact angle tests of EGaIn on epoxy surfaces demonstrate the wettability of EGaIn on flat surfaces. SEM cross-sections of microchannels reveal adhesion of EGaIn residue to channel walls. Micro-computed tomography (microCT) scans of provide volumetric measurements of EGaIn remaining inside channels after flow cycling. Non-wetting coatings are proposed as materials based strategy to overcome these issues in future work.

Paper Details

Date Published: 22 March 2018
PDF: 7 pages
Proc. SPIE 10596, Behavior and Mechanics of Multifunctional Materials and Composites XII, 1059611 (22 March 2018); doi: 10.1117/12.2300264
Show Author Affiliations
Anthony S. Griffin, Beckman Institute for Advanced Science and Technology (United States)
Univ. of Illinois at Urbana-Champaign (United States)
Nancy R. Sottos, Beckman Institute for Advanced Science and Technology (United States)
Univ. of Illinois at Urbana-Champaign (United States)
Scott R. White, Beckman Institute for Advanced Science and Technology (United States)
Univ. of Illinois at Urbana-Champaign (United States)


Published in SPIE Proceedings Vol. 10596:
Behavior and Mechanics of Multifunctional Materials and Composites XII
Hani E. Naguib, Editor(s)

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