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Proceedings Paper

Feature extraction of the wafer probe marks in IC packaging
Author(s): Cheng-Yu Tsai; Chia-Te Lin; Chen-Ting Kao; Chau-Shing Wang
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Paper Abstract

This paper presents an image processing approach to extract six features of the probe mark on semiconductor wafer pads. The electrical characteristics of the chip pad must be tested using a probing needle before wire-bonding to the wafer. However, this test leaves probe marks on the pad. A large probe mark area results in poor adhesion forces at the bond ball of the pad, thus leading to undesirable products. In this paper, we present a method to extract six features of the wafer probe marks in IC packaging for further digital image processing.

Paper Details

Date Published: 19 December 2017
PDF: 5 pages
Proc. SPIE 10613, 2017 International Conference on Robotics and Machine Vision, 1061308 (19 December 2017); doi: 10.1117/12.2299924
Show Author Affiliations
Cheng-Yu Tsai, National Changhua Univ. of Education (Taiwan)
Chia-Te Lin, National Changhua Univ. of Education (Taiwan)
Chen-Ting Kao, National Changhua Univ. of Education (Taiwan)
Chau-Shing Wang, National Changhua Univ. of Education (Taiwan)


Published in SPIE Proceedings Vol. 10613:
2017 International Conference on Robotics and Machine Vision
Chiharu Ishii; Genci Capi; Jianhong Zhou, Editor(s)

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