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Proceedings Paper

Measurement of pattern roughness and local size variation using CD-SEM: current status
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Paper Abstract

Measurement of line edge roughness (LER) is discussed from four aspects: edge detection, PSD prediction, sampling strategy, and noise mitigation, and general guidelines and practical solutions for LER measurement today are introduced. Advanced edge detection algorithms such as wave-matching method are shown effective for robustly detecting edges from low SNR images, while conventional algorithm with weak filtering is still effective in suppressing SEM noise and aliasing. Advanced PSD prediction method such as multi-taper method is effective in suppressing sampling noise within a line edge to analyze, while number of lines is still required for suppressing line to line variation. Two types of SEM noise mitigation methods, "apparent noise floor" subtraction method and LER-noise decomposition using regression analysis are verified to successfully mitigate SEM noise from PSD curves. These results are extended to LCDU measurement to clarify the impact of SEM noise and sampling noise on LCDU.

Paper Details

Date Published: 13 March 2018
PDF: 11 pages
Proc. SPIE 10585, Metrology, Inspection, and Process Control for Microlithography XXXII, 105850H (13 March 2018); doi: 10.1117/12.2299633
Show Author Affiliations
Hiroshi Fukuda, Hitachi High-Technologies Corp. (Japan)
Takahiro Kawasaki, Hitachi High-Technologies Corp. (Japan)
Hiroki Kawada, Hitachi High-Technologies Corp. (Japan)
Kei Sakai, Hitachi High-Technologies Corp. (Japan)
Takashi Kato, Hitachi High-Technologies Corp. (Japan)
Satoru Yamaguchi, Hitachi High-Technologies Corp. (Japan)
Masami Ikota, Hitachi High-Technologies Corp. (Japan)
Yoshinori Momonoi, Hitachi High-Technologies Corp. (Japan)

Published in SPIE Proceedings Vol. 10585:
Metrology, Inspection, and Process Control for Microlithography XXXII
Vladimir A. Ukraintsev, Editor(s)

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