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Proceedings Paper

Benchmarking 3-color photoresists for multiphoton absorption lithography
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Paper Abstract

The demand to create ever finer features at ever tighter pitches has fueled the drive towards lithographic methods that use radiation with the shortest possible wavelength. This approach, however, faces a considerable number of technological challenges that need to be addressed. An alternative, cost-effective approach is multicolor lithography. Inspired by the technology for superresolution in optical microscopy, multicolor visible light approaches led to achieving features down to λ/20 using 3-D multiphoton absorption polymerization (MAP). Although these original efforts in the field involved the use of two colors of light, it has become apparent that 3-color approaches will be required to address the need to pack features together tightly. In this work, we present some of the latest progress in the benchmarking and development of three-color photoresist materials, and demonstrate how the addition of a third color in the exposure scheme can lead to substantial improvements in resolution.

Paper Details

Date Published: 19 March 2018
PDF: 6 pages
Proc. SPIE 10584, Novel Patterning Technologies 2018, 1058417 (19 March 2018); doi: 10.1117/12.2299318
Show Author Affiliations
Nikolaos Liaros, Univ. of Maryland, College Park (United States)
Sandra A. Gutierrez Razo, Univ. of Maryland, College Park (United States)
Zuleykhan Tomova, Univ. of Maryland, College Park (United States)
John S. Petersen, Univ. of Maryland, College Park (United States)
Periodic Structures, Inc. (United States)
John T. Fourkas, Univ. of Maryland, College Park (United States)


Published in SPIE Proceedings Vol. 10584:
Novel Patterning Technologies 2018
Eric M. Panning, Editor(s)

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