Share Email Print

Proceedings Paper

Quantitative monitoring of hole-edge damage growth using eddy current array sensor-based intelligent bolt
Author(s): Hu Sun; Jianbo Shao; Yishou Wang; Xinlin P. Qing
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Hole-edge damage of joint structure is one type of the most closely watched damages for ultrahigh buildings, bridges, aircrafts, etc., due to stress concentration at the bolt hole and complex load conditions. This paper employs an eddy current array sensor, made by flexible printed circuit technology, bonded on the bolt screw to monitor the growth of hole-edge damage. Coil winding configuration of the eddy current array sensor made by one actuation coil throughout all depth and several sensing coils along the depth is proposed to quantify the damage growth, especially the damage depth. Simulation and experimental study were conducted to verify the ability of quantitatively monitoring the hole-edge damage growth.

Paper Details

Date Published: 27 March 2018
PDF: 8 pages
Proc. SPIE 10600, Health Monitoring of Structural and Biological Systems XII, 1060005 (27 March 2018); doi: 10.1117/12.2299272
Show Author Affiliations
Hu Sun, Xiamen Univ. (China)
Jianbo Shao, Xiamen Univ. (China)
Yishou Wang, Xiamen Univ. (China)
Xinlin P. Qing, Xiamen Univ. (China)

Published in SPIE Proceedings Vol. 10600:
Health Monitoring of Structural and Biological Systems XII
Tribikram Kundu, Editor(s)

© SPIE. Terms of Use
Back to Top