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Proceedings Paper

Non-destructive contactless tool for semiconductor wafer inspection
Author(s): O. V. Astafiev
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Paper Abstract

A method for semiconductors investigation and technological inspection are represented. It's optical non-destructive contactless and expressive tool. There are two general ways for the method applications. The first one is detection of inhomogeneities for free carrier distribution in bulk of semiconductor, which occur due to electrically active defect. The second one is direct visualization of recombination picture on surface of semiconductor wafer (in over words, it's lifetimes mapping).

Paper Details

Date Published: 1 September 1996
PDF: 2 pages
Proc. SPIE 2778, 17th Congress of the International Commission for Optics: Optics for Science and New Technology, 27782F (1 September 1996); doi: 10.1117/12.2298969
Show Author Affiliations
O. V. Astafiev, General Physics Institute (Russian Federation)


Published in SPIE Proceedings Vol. 2778:
17th Congress of the International Commission for Optics: Optics for Science and New Technology
Joon-Sung Chang; Jai-Hyung Lee; ChangHee Nam, Editor(s)

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