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Proceedings Paper

Advanced CD-SEM solution for edge placement error characterization of BEOL pitch 32nm metal layers
Author(s): A. Charley; P. Leray; G. Lorusso; T. Sutani; Y. Takemasa
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Paper Abstract

Metrology plays an important role in edge placement error (EPE) budgeting. Control for multi-patterning applications as new critical distances needs to be measured (edge to edge) and requirements become tighter and tighter in terms of accuracy and precision. In this paper we focus on imec iN7 BEOL platform and particularly on M2 patterning scheme using SAQP + block EUV for a 7.5 track logic design. Being able to characterize block to SAQP edge misplacement is important in a budgeting exercise (1) but is also extremely difficult due to challenging edge detection with CD-SEM (similar materials, thin layers, short distances, 3D features). In this study we develop an advanced solution to measure block to SAQP placement, we characterize it in terms of sensitivity, precision and accuracy through the comparison to reference metrology. In a second phase, the methodology is applied to budget local effects and the results are compared to the characterization of the SAQP and block independently.

Paper Details

Date Published: 16 March 2018
PDF: 7 pages
Proc. SPIE 10585, Metrology, Inspection, and Process Control for Microlithography XXXII, 1058519 (16 March 2018); doi: 10.1117/12.2298408
Show Author Affiliations
A. Charley, IMEC (Belgium)
P. Leray, IMEC (Belgium)
G. Lorusso, IMEC (Belgium)
T. Sutani, Hitachi High-Technologies Corp. (Japan)
Y. Takemasa, Hitachi High-Technologies Corp. (Japan)

Published in SPIE Proceedings Vol. 10585:
Metrology, Inspection, and Process Control for Microlithography XXXII
Vladimir A. Ukraintsev, Editor(s)

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